FIELD: electronics. SUBSTANCE: electric insulation compound includes, per cent by mass: mica flour 5.5-11.0; aeroseal 1.5-5.5; grease 1.8-2.8; cyclohexanol 27.0-30.0; epoxy resin 33.0-38.0; resin hardener 21.0-23.0. EFFECT: proposed compound provides for manufacture of thin insulation film with high surface resistance over substrates. 1 tbl
Title | Year | Author | Number |
---|---|---|---|
CONDUCTOR PASTE | 1992 |
|
RU2043667C1 |
CONDUCTING COMPOSITION | 1986 |
|
SU1353162A1 |
ELECTRIC INSULATION SEALING COMPOUND | 0 |
|
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POLYMER CONDUCTIVE PASTE FOR SOLAR CELLS WITH HETEROJUNCTIONS | 2020 |
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RU2746270C1 |
ELECTROCONDUCTIVE COMPOSITION FOR THIN-FILM CONDUCTORS | 0 |
|
SU1003154A1 |
CURRENT-CONDUCTING ADHESIVE COMPOSITION | 2015 |
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RU2612717C2 |
ELECTROCONDUCTIVE PASTE | 1990 |
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RU2024081C1 |
THICK-FILM RESISTOR FABRICATION METHOD | 2014 |
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RU2552626C1 |
THICK-FILM RESISTOR FABRICATION METHOD | 2014 |
|
RU2552631C1 |
GLASS FOR INSULATING METAL COATING | 0 |
|
SU1754682A1 |
Authors
Dates
1995-09-10—Published
1992-05-20—Filed