FIELD: mounting of units and components of radio and electronic equipment by low-temperature soldering. SUBSTANCE: flux contains, by weight of: formic acid 4-10; triethanolamine 1-3; ethyl alcohol the balance. Flux is nontoxic, provides increased reducing effect and spreading of solder. The process of removal of flux remainder is not required since acid component is degraded into gaseous constituents CO CO2 and H H2 in the process of soldering. EFFECT: increased efficiency and enhanced reliability.
| Title | Year | Author | Number |
|---|---|---|---|
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463145C2 |
| LOW-TEMPERATURE SOLDERING AND TINNING FLUX | 0 |
|
SU1660910A1 |
| FLUX FOR LOW TEMPERATURE SOLDERING | 2009 |
|
RU2400340C1 |
| PASTE FOR SOLDERING | 0 |
|
SU1555091A1 |
| FLUX FOR SOLDERING AND TINNING | 0 |
|
SU1303341A1 |
| FLUX FOR SOLDERING AND TINNING UNITS AND ASSEMBLIES OF ELECTRONIC COMPONENTS | 0 |
|
SU1407732A1 |
| FLUX FOR LOW-TEMPERATURE SOLDERING OF RADIO AND ELECTRONIC EQUIPMENT COMPONENTS | 1993 |
|
RU2043894C1 |
| PRESERVING FLUX FOR LOW-TEMPERATURE WELDING | 1994 |
|
RU2056990C1 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463144C2 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1759587A1 |
