FLUX FOR LOW TEMPERATURE SOLDERING Russian patent published in 2010 - IPC B23K35/363 

FIELD: machine building.

SUBSTANCE: invention can be implemented at production of electron and radio-electron equipment at assembly of units and blocks on printed circuit boards of hybrid and integral circuits. Flux contains components at the following ratio of components, wt %: industrial glycerine 30.0-32.0; tri-ethanol-amine 2.5-3.0; colophony 8.0-9.35; carbamide 6.0-9.0; sodium 1.1.-1.5; alcohol - the rest.

EFFECT: chosen quantitative ratio of components facilitates activated removal of oxide films and high quality of soldered connections, their raised corrosion resistance and reliability; also residues of flux are easily removed with distilled water event at high density of point-to-point wiring.

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