FIELD: radio engineering. SUBSTANCE: pattern of bonding pads specularly reflecting pattern of bonding pads on substrate of board is formed on surface of polyimide foiled with aluminium. Solder is deposited on bonding pads to connect them by soldering. Then polyimide is removed and assembly columns are formed on surface of substrate which make it possible to perform assembly of mounted elements by welding. EFFECT: enhanced output of good articles. 7 dwg
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