FIELD: electricity.
SUBSTANCE: invention may be used for surface installation of electronic components with ball leads by flip-chip method and particularly for installation of electronic component with ball lead matrix. Installation method of electronic components with ball leads provides for application of flip-chip method including ball leads positioning, fastening and connection to printed circuit card mounting surface contacts, which are mechanically and electrically connected with plated-through holes by soldering. Prior to positioning, printed circuit card is turned over, with its mounting surface directed downwards, ball leads of electronic component being placed under plated-thought holes contacts, with the said special orientation of printed circuit card preserved for the time of all operation execution.
EFFECT: production of reliable high-quality soldered connection during surface installation of electronic components.
4 cl, 4 dwg
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