FIELD: electronic engineering.
SUBSTANCE: proposed method for producing microwave hybrid integrated circuit includes printing layout pattern of metal film conductors and at least one wiring pad on face end of insulating substrate for disposing at least one pendant-component chip; disposing, aligning, and connecting internal ends of flat beam terminals of output frame with contact pads disposed on face end of pendant-component chips; removing auxiliary parts of output frame; disposing pendant-component chips on wiring pads; and connecting external ends of flat beam terminals of output frame to layout pattern metal film conductors; auxiliary parts of output frame are removed upon connecting external ends of output-frame flat beam terminals with layout pattern film metal conductors either completely or partially; pendant-component chips are disposed on wiring pads either simultaneously or in definite sequence; external ends of output-frame flat beam terminals are connected to layout pattern metal film conductors either directly or (and/or) by means of pendant-component chips.
EFFECT: enhanced yield, improved electrical characteristics of microwave hybrid integrated circuits.
3 cl, 2 dwg
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