METHOD OF MAKING THIN-FILM MULTILEVEL BOARDS FOR MULTICHIP MODULES, HYBRID INTEGRATED CIRCUITS AND CHIP ASSEMBLIES Russian patent published in 2012 - IPC H01L21/77 

FIELD: physics.

SUBSTANCE: in the method of making thin-film multilevel boards for multichip modules, chip assemblies and hybrid integrated circuits, involving preparation of the basic board on which switching levels are formed by successively depositing metallisation layers and forming the layout the first and subsequent switching levels, according to the invention, all connection pads of the circuit both for subsequent connection thereof with leads of active components and connection pads for electrical connection to external leads are located in the first conducting level, which is in form a multilayer coating of V-Cu-Ni+chemical Ni, where chemical Ni is used as a stop layer when forming subsequent switching levels, conducting layers 'signalling' and potential layers 'power' and 'earth' are grown in separate levels.

EFFECT: high stability of operation of devices, high assembly density, reduced weight and size, as well as simple process and providing guaranteed welding of ready boards when installing added components owing to location of all connection pads in the first conducting layer.

2 cl, 1 tbl, 10 dwg