FIELD: electronics. SUBSTANCE: crystal, points of attachment of conductors to leads and bonding pads are covered with protecting layer of optically transparent silicon-organic compound. Area of protective layer and its thickness are chosen from specified relationships. Package is manufactured from optically transparent epoxy compound containing epoxy resin, carboxylate rubber, anhydrite hardener, amine catalyst and compound with common formula . EFFECT: enhanced attachment reliability. 4 cl, 5 dwg
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Authors
Dates
1996-02-10—Published
1992-03-02—Filed