FIELD: vacuum plasma processing, method and apparatus are used for cleaning and spraying on pieces surface of thing film protecting and decorating coating in mechanical engineering, microelectronics, light and other branches of industry. SUBSTANCE: method provides for piece dipping in inert plasma forming gas stream achieving cleaning and heating of its surface and then it is dipped in transporting gas plasma stream bearing substances of spraying. Process is carried out with ions energy in plasma flux of no less than 1,5 potentials of ionization of plasma forming gas. Gas discharge appears between plasma flux, that serves as anode, and treated piece, that acts as cathode. Treated pieces in plasma flux are continuously uniformly rotated around axis perpendicular to flux axis, that provides their uniform treatment. Apparatus for pieces treatment has mounted in processing vacuum chamber 1 plasma accelerator, before nozzle output cutout of which on shaft 6 of rotation drive there is a pieces metal holder 2 made in the form pf chuck 3 with mandrels 4, that are fixed on it so, that allow depending on sizes and form of pieces and given modes to provide uniform treatment of pieces surfaces according to given parameters. EFFECT: method and apparatus allow to provide uniform treatment of pieces surfaces according to given parameters. 11 cl, 3 dwg
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Authors
Dates
1996-07-10—Published
1993-06-11—Filed