PRINTED CIRCUIT BOARD WITH INTERNAL MOUNTING OF ELEMENTS AND METHOD OF ITS MANUFACTURE Russian patent published in 2017 - IPC H05K1/14 H05K3/46 H01L21/50 H01L23/12 

FIELD: electricity.

SUBSTANCE: design of the printed circuit board (PCB) includes a single or multi-layered base and a tracking set (TS) made of glass-textolite foil and prepreg. The height of the TS layers exceeds the height of the largest frameless ERI not less than 0.2 mm. In multi-layer printed circuit boards (MPP), there are one or several cavities, within which frameless electro-radio products (ERP) are installed and sealed on the topology with a non-shrinkable compound, which are mated with metallized holes with encapsulated ERP on the back of the base and the top layer of the TS. When manufacturing the PP in the TS, technological windows are created. When assembling the MPP, first the layers of the base and then the layers of the TS are laid out, followed by pressing, after which metallized holes are created. Framed ERPs are installed on one or both sides of the MPP after the complete curing of the non-shrinkable compound.

EFFECT: creating the design of a printed circuit board with built-in active and passive frameless electro-radio products that are not exposed to high temperatures and pressure, allowing the installation of electro-radio products with a height of hundreds of microns and, consequently, increased capacity and power.

2 cl, 2 dwg