FIELD: microelectronics. SUBSTANCE: aluminium substrate is electrochemically anodized, thermally treated, and upon repeated heat treatment at 550 C, two thin insulating substrates are separated. EFFECT: facilitated procedure. 5 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD OF PRODUCTION OF DIELECTRIC LAYERS ON LOCAL SECTIONS OF SUBSTRATE AND DEVICE FOR ITS REALIZATION | 1995 |
|
RU2076478C1 |
METHOD FOR MANUFACTURING HYBRID HIGHLY INTEGRATED CIRCUIT | 1993 |
|
RU2065641C1 |
METHOD OF PRODUCING DIELECTRIC LAYER ON ALUMINIUM SUBSTRATE SURFACE | 2018 |
|
RU2694430C1 |
PRINTED-CIRCUIT BOARD MANUFACTURING PROCESS | 1991 |
|
RU2022496C1 |
METHOD FOR MANUFACTURING NEGATIVE ELECTRODE OF DISK ELECTRIC STORAGE ELEMENT | 1993 |
|
RU2074458C1 |
BAND-PASS LIGHT FILTER | 1993 |
|
RU2079861C1 |
PROCESS OF MANUFACTURE OF DIELECTRIC SUBSTRATES WITH HOLES | 1992 |
|
RU2030136C1 |
METHOD OF OBTAINING DIELECTRIC SUBSTRATES | 1974 |
|
SU524440A1 |
METHOD OF CONTROLLING PROCESS IN ALUMINIUM ELECTROLYZER | 1995 |
|
RU2087598C1 |
METHOD FOR PRODUCING CATALYTICALLY ACTIVE COMPOSITE MATERIAL | 2017 |
|
RU2641290C1 |
Authors
Dates
1997-01-10—Published
1992-12-09—Filed