FIELD: electrical engineering; radio engineering.
SUBSTANCE: invention relates to electrical engineering, radio engineering, electronics and microwave engineering and can be used in the technology of manufacturing microwave elements of hybrid microassemblies. Method includes anodizing the surface of the metal base, removing the anode layer in the points of contact of the circuit elements with the metal base, metallization of the anodized base, formation of the circuit pattern by cutting of metallization along the closed circuit board elements, after which anodic etching of the film structure located outside the circuit board elements circuit is performed.
EFFECT: wider frequency zone of operation of hybrid microassemblies, providing good heat removal and reliable grounding, high quality of the printed circuit board due to the absence of the need to perform topology formation by photolithography.
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| Title | Year | Author | Number |
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