METHOD FOR ASSEMBLY OF SEMICONDUCTOR BRIDGE Russian patent published in 1997 - IPC

Abstract RU 2072588 C1

FIELD: electronic devices. SUBSTANCE: two current inputs of carrying frame 1 have pair of semiconductor elements 2, which are connected to each other electrically and mechanically by means of strips 3 of specific shape. In addition one pair is connected to one current input which is free of semiconductor elements, another pair is connected to another current input. Rigid bond is removed on housing side before sealing, bond on side of bridge terminals is removed after sealing. EFFECT: increased functional capabilities. 4 dwg

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RU 2 072 588 C1

Authors

Polityko A.M.

Fedjaev R.V.

Rozhdestvenskij G.F.

Dates

1997-01-27—Published

1992-03-27—Filed