FIELD: microelectronics; patterning in dielectric and piezoelectric substrates in fabricating waveguides, micromechanical devices, quartz resonators, etc. SUBSTANCE: a dielectric film is applied onto a substrate and made into a protective mask configuration. Then the substrate is etched. Neodymium monoaluminate film with a thickness of no less than 1 mcm is used as a material for the mask. EFFECT: facilitated procedure.
Title | Year | Author | Number |
---|---|---|---|
PROCESS OF RELIEF FABRICATION IN DIELECTRIC SUBSTRATE | 1992 |
|
RU2054747C1 |
METHOD FOR PRODUCING EMBOSSED SURFACE ON DIELECTRIC SUBSTRATE | 2005 |
|
RU2318268C2 |
AT-CUR CRYSTAL ELEMENT MANUFACTURING PROCESS | 1995 |
|
RU2117382C1 |
METHOD TO MANUFACTURE QUARTZ CRYSTALLINE ELEMENTS OF Z-SECTION | 2012 |
|
RU2475950C1 |
METHOD OF PRODUCING RELIEF IN DIELECTRIC SUBSTRATE | 2018 |
|
RU2687299C1 |
PROCESS OF MANUFACTURE OF QUARTZ CRYSTALLINE ELEMENTS | 1989 |
|
RU1739826C |
METHOD FOR TUNING SUPERNARROW-BAND ACOUSTIC-SURFACE-WAVE ELEMENT TO CENTER FREQUENCY | 2000 |
|
RU2190922C2 |
PIEZOELECTRIC CAVITY | 1992 |
|
RU2047267C1 |
SOLUTION FOR REMOVING ALUMINIUM FILMS BY PICKLING | 0 |
|
SU956620A1 |
PIEZOELECTRIC RESONATOR | 1994 |
|
RU2107987C1 |
Authors
Dates
1997-05-20—Published
1994-05-11—Filed