INTEGRATED CIRCUIT PACKAGE Russian patent published in 1997 - IPC

FIELD: electronic engineering. SUBSTANCE: device has base with wiring area and base-mounted carrying frame closed with plastic cover, as well as leads. Novelty in that package is designed multiple on-line connection to electronic devices. Wiring area is deepened in base and leads are placed in plane and within size of base, their rear side is connected to carrying frame of same size as base and has recess to receive plastic cover. EFFECT: reduced thickness of package, improved mechanical strength and heat transfer. 2 dwg