INTEGRATED-CIRCUIT PACKAGE Russian patent published in 1998 - IPC

FIELD: electronic engineering. SUBSTANCE: package has metal base 1 with wiring pad 2, metal carrying frame 3, plastic cover 4, terminal leads 5, second frame 6 mounted on carrying frame 3 and provided with depression 7 closed with plastic cover 4. Integrated-circuit package is three-layer metal plate with plastic cover 4, its one side functioning as flat metal base 1. Other side is plastic cover 4 with metal bezel of second frame 6. Integrated-circuit chip is mounted on wiring pad 2 depressed into metal base 1. Leads 5 are located within plane of carrying frame 3 and are, essentially, its parts. Ends of leads 5 are part of package end so that they are connected electrically to spring contacts of electronic device to be coupled with integrated circuit. Contact is ensured by pressure of end of integrated-circuit package onto spring contacts of electronic device. EFFECT: facilitated installation of integrated-circuit package in respective electronic device. 5 dwg