FIELD: semiconductor devices with voltage-controlled reactance. SUBSTANCE: reactor has working region of uniformly doped resistive-contact semiconductor whereon p-n junction to other contact is formed. Working region is made in the form of truncated triangular prism with base sides L1, L2, and D. Formed on side faces of working region with sides L1 and L2 are p-n junctions or schottky barriers with common contact and on face with side D, resistive contact. Varactor capacitance C due to back bias U in the range of back biases Umin≅ U ≅ Umax satisfies condition , where S1 and S2 are geometric areas of faces with sides L1 and L2, respectively; R(U) is spatial charge region thickness in semiconductor at back bias U; εo= 8,85•10-2 F/m; ε is relative dielectric constant of semiconductor. Dope concentration in working region and its geometry are chosen so that increasing back bias due to overlapping of spatial charge region from opposing faces causes variation in effective areas of plates S1(U) and S2(U); desired variation mechanism S(U) is ensured either by adequate selection of face height as function of distance H f(H) measured from point of intersection of sides L1 and L2 with side D along L1 and L2 or, in case of given f(h), or by selection of distance between L1 and L2 as function of H; size of side D satisfies condition 2R(Ubr)≥D≥2R(O), where Uпр is breakdown voltage. Working region may be doped nonuniformly. One of varactor faces with sides L1 and L2 is doped-conductor-to-insulating-substrate interface. EFFECT: facilitated control of varactor reactance. 3 cl, 2 dwg
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Authors
Dates
1997-06-27—Published
1994-03-14—Filed