FIELD: microelectronics; manufacture of parametric amplifiers, generators, and inertialess variable capacitors. SUBSTANCE: semiconductor device has semiconductor in the form of film with semiconductor junction formed with heterogeneous impurity profile along surface coordinate axis X. Formed on semiconductor surface along surface coordinate axis Y are conducting strips arranged in spaced relation to each other and to ohmic contact; conducting strips are connected to conducting section formed on insulating layer or high-resistance semiconductor; conducting pad is formed on other surface of insulation or high-resistance semiconductor. Insulating or high-resistance layer is formed over free surface of device. EFFECT: provision for adjusting value of device capacitor placed between conducting strips in case of control voltage fluctuations. 2 cl, 4 dwg
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Authors
Dates
1998-08-10—Published
1995-12-15—Filed