FIELD: production of semiconductor photodetecting modules, matrices. SUBSTANCE: the infrared detector rated at a wave band of 1.5 to 6 um has a layer of single-crystal high-resistance silicon, of which a layer of photoabsorption with a dope concentration of (7-9)•1017cm-2 and a contact layer, 100 to 500 thick, with a dope concentration of (5-9)•1019 cm-3 are made in the form of a mesa-structure. A similar high-doped thin contact layer is formed on the other surface single-crystal silicon. Resistive layers are made on the contact layers. EFFECT: improved design. 4 dwg, 1 tbl
Authors
Dates
1996-08-10—Published
1993-06-04—Filed