ELECTRICAL EMBEDMENT COMPOUND Russian patent published in 2009 - IPC H01B3/18 C08L63/04 

FIELD: electricity.

SUBSTANCE: invention is attributed to the field of electric engineering specifically to epoxide thin filling compounds used for electric insulating and reinforcing by means of embedding of high-voltage power supply units, transformers, electric circuitry, uncased and cased electric couplers, for sealing and protecting elements of radio-electronic devices against moisture and mechanical impacts. Composition for filling compound with moderate initial viscosity contains 30-36 wt-p. of epoxide diane resin, 12-20 wt-p. of threeglycid polyoxypropylene triol ether, 10-12 wt-p. of monoglycid n-butanol ether, 18-22 mass-p. of low-polymeric polyamid resin and 7-10 wt-p. of aliphatic amine.

EFFECT: creation of electric insulating filling compound composition keeping resiliency not less than for an hour, having high specific volume, high value of surface electric resistance and increased elasticity.

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