FIELD: semiconductor engineering; environmental tests of manufactured semiconductor devices and measurement of their technical characteristics. SUBSTANCE: heat chamber has casing accommodating working chamber with fan installed therein between exhaust and delivery pipes, circulating air cleaning unit in the form of coaxially joined contracting diffuser with internal grooves and expanding nozzle with drying device occupying its entire outlet section area; drying device is made in the form of vessel filled with adsorbent and formed by external and internal lattices. EFFECT: enlarged functional capabilities. 2 dwg
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Authors
Dates
1997-08-10—Published
1992-12-14—Filed