FIELD: SHF devices used in manufacture of multistep collectors with energy recuperation. SUBSTANCE: for decrease of coefficient of secondary electron emission material is treated in composition carrying reagents selectively dissolving one of components of two-phase alloy. Copper-molybdenum alloy is used in the capacity of this material and treatment is carried out in bath containing 3.0 g of sodium nitrite, 1.0 l of sulfuric acid at temperature 80-90 C in the course of not longer than 3 min. EFFECT: decreased coefficient of secondary electron emission. 1 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| MATERIAL FOR MANUFACTURING ELECTRODES OF MICROWAVE DEVICE COLLECTOR | 1993 |
|
RU2077090C1 |
| PROCESS OF MANUFACTURE OF PARTS OF ELECTRON DEVICES FROM PYROLYTIC GRAPHITE | 1991 |
|
RU2024095C1 |
| PROCESS OF MANUFACTURE OF COPPER COLLECTOR FOR POWERFUL SHF DEVICE OF O-TYPE | 1991 |
|
RU2014660C1 |
| METHOD OF TEXTURING SURFACES OF PARTS OF ARBITRARY SHAPE OF CARBON MATERIAL | 2020 |
|
RU2734323C1 |
| NANOCARBON MATERIAL FOR SUPPRESSION OF SECONDARY ELECTRON EMISSION AND METHOD FOR ITS PRODUCTION | 2021 |
|
RU2770303C1 |
| METHOD FOR MANUFACTURING COPPER COLLECTOR FOR HIGH-POWER O-TYPE DEVICE | 2001 |
|
RU2196371C1 |
| PROCESS OF MANUFACTURE OF SECONDARY EMISSION CATHODE | 1990 |
|
RU2069915C1 |
| COLLECTOR OF SHF DEVICE OF O-TYPE | 1990 |
|
RU2047241C1 |
| METHOD OF PRODUCING EMISSION-ACTIVE CATHODE ALLOY | 2014 |
|
RU2581151C1 |
| METHOD OF SOLDERING ELECTRONIC DEVICE ELEMENTS | 2009 |
|
RU2405663C1 |
