FIELD: electronic engineering; manufacture of microwave devices such as klystrons. SUBSTANCE: molybdenum bushings are press-fitted while hot into copper case of collector and is held in position due to difference in coefficients of linear temperature expansion and due to diffusion welding of copper collector to molybdenum bushings through intermediate nickel layer at the same time fusing nickel in welding-and-soldering process. Such jointing of high- melting molybdenum bushings with copper collector ensures best contact and heat transfer from molybdenum bushings whereon incident electron beam occurs in the course of device operation. EFFECT: enhanced quality due to tight contact between copper collector and bushings throughout entire mating area. 5 cl, 3 dwg
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Authors
Dates
2003-01-10—Published
2001-05-29—Filed