FIELD: machining of diamonds used in tools, heat sinks. SUBSTANCE: diamond is subjected to such machining as grinding or cutting with irradiation of diamond surface by laser beam having wave length in region from 190 to 360 nm. Density of luminous power of beam, angle of beam scattering and half-width of oscillatory spectrum are chosen properly. Pulsating laser beam is directed through cylindrical lens. Diamond can be machined in certain material to improve planeness of face side and rate of machining. EFFECT: improved planeness of face side and rate of machining. 13 cl, 2 dwg
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