FIELD: mechanical engineering. SUBSTANCE: according to method, initially contacting surfaces are appropriately prepared and connected together by soldering. Components to be joined are heated to temperature of 0.4-0.6 of solder liquidus temperature. First isothermal delay is undertaken during 20-30 min. Then, components to be joined are heated to temperature of 1.1-1.2 of solder liquidus temperature. Second isothermal delay is undertaken during 5.0-20 min and cooling is effected. From temperature of 1.1-1.2 to temperature of 0.6-0.8 of solder liquidus temperature, composite model is cooled at speed of 50-100 deg/min. From temperature of 0.6-0.8 of solder liquidus temperature, composite model is cooled at speed of 5.0-10 deg/min. Soldering is effected with powder of alloy of system copper-nickel-phosphorus of 20-100 mcm fraction from band of 30-50 mcm thickness. In result, achieved is high strength of joining, improved is reliability of target in operation. EFFECT: high efficiency. 3 cl
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Authors
Dates
1998-02-10—Published
1996-08-01—Filed