FIELD: radio engineering, in particular, heat removal from electronic unit which is located on printed circuit, is heated and has planar terminals. SUBSTANCE: device has heat- conducting housing, printed circuit 2 which is mounted in unit housing 1, electronic unit 3 which is located on printed circuit, is heated and has planar terminals 4. In addition housing has heat removing base 5. Terminals 4 of electronic unit 3 are bent at right angle in opposite to heat removing base 5. They are located in through holes 7 of printed circuit 2 and are soldered on its contact plates on side 8 which is opposite to side on which electronic unit 3 is mounted. Heat removing base 5 of housing of electronic unit 3 is connected to housing 1 in order to provide heat contact between them. In addition assembling sleeves 10 are mounted between printed circuit and unit housing 1. Printed circuit 2 also has viewing window 16 and access hole 15 which are directed respectively to front side of housing of electronic unit 3 and connection points of heat removing base 5 of housing to unit housing 1. EFFECT: increased heat removal. 3 dwg
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Authors
Dates
1998-02-20—Published
1996-07-02—Filed