RADIO ELECTRONIC ASSEMBLY Russian patent published in 1998 - IPC

FIELD: radio engineering, in particular, heat removal from heat-emitting planar-terminal electronic unit which is mounted on printed circuit board. SUBSTANCE: device has heat-conducting housing, printed circuit board which is located in housing and carries heat-emitting electronic unit, which has heat-removal base and planar terminals. Terminals are bent at right angle in opposite side from heat-conducting base of electronic unit. They are located in holes of printed circuit board and soldered to its contact areas on their sides which are opposite to mounted electronic unit. Heat-conducting base of electronic unit engages with housing through dielectric heat-conducting gasket. Screw joints for pressing them against housing are located on side of external surface of housing and are passed through corresponding holes which are made in housing, dielectric gasket and dielectric barrels which are located in holes of heat-removal base of electronic unit. Printed circuit board is equipped with holes which are directed towards nuts turned on screw ends of screw joints. In addition device has members for fixation of space between board and inner surface of housing. They are connected to housing by means of screws which are drawn into holes of these members on external side of housing. EFFECT: improved heat removal. 3 dwg