RADIO ELECTRONIC ASSEMBLY Russian patent published in 1998 - IPC

FIELD: radio engineering, in particular, heat removal from heat-emitting planar-terminal electronic unit, which is mounted on printed circuit board in such housings as 4116.4-3, 4116.8-3 according to GOST-17467-89. SUBSTANCE: device has heat-conducting housing, printed circuit board which is located in housing and carries heat-emitting electronic unit, which has heat-removal base and planar terminals. Terminals are bent at right angle in opposite to heat-conducting base of electronic unit. They are located in holes of printed circuit board and soldered to its contact areas on its side which is opposite to mounted electronic unit. Heat-removal base of electronic unit engages with housing in which first and second groups of pins are anchored. Pins of first group are passed through holes which are made in support members of printed circuit board. Pins of second group are passed through holes which are provided in heat-removal base of electronic unit. They carry dielectric barrels which grooved lower ends are located in holes of heat-removal base of electronic unit. Upper ends of barrels are passed through corresponding holes in printed circuit board. Screw ends of pins which are extended over printed circuit board from its support members and from dielectric barrels are equipped with nuts turned on screw ends of screw joints. EFFECT: improved heat removal. 3 dwg