METHOD OF PRODUCTION OF DOUBLE-SIDED PRINTED BOARD Russian patent published in 2015 - IPC H05K3/46 H05K3/42 H05K3/06 H05K3/38 

FIELD: printing industry.

SUBSTANCE: in non-conductive substrate in predetermined coordinates of PC board layout the through via holes are performed, then on the surface of the said substrate on both sides and on the walls of the via holes the adhesive underlayer is applied in a single process, as well as a conductive layer and a metal mask layer, then on the mask layer on both sides of the substrate and on the walls of the via holes a soluble protective layer is applied, resistant to chemical etchants, then the printed board pattern is formed by laser evaporation on both sides, at least of the protective layer and the mask layer on the areas not occupied by conducting paths, then the conductive layer and the adhesive underlayer is removed by selective chemical etching on the areas opened by laser evaporation, then the protective layer is removed with a solvent on the areas unopened by laser evaporation (conducting paths of printed board) and in the via holes, then the metal layer of mask is removed by selective chemical etching from the conducting paths and in the via holes, finally, the protective barrier layer is applied and a layer that provides solderability and/or weldability of the surface on both sides of the substrate on the conducting paths and in the via holes.

EFFECT: improvement of quality of metallization pattern, improvement of reliability of switching between the sides of the board, improvement of electrical parameters of the conductive layer, increase in efficiency of the method.

11 cl, 13 dwg, 8 tbl, 2 ex