METHOD TO CREATE CONDUCTING PATHS Russian patent published in 2013 - IPC H01L21/28 

FIELD: electricity.

SUBSTANCE: method to create conducting paths includes application of solid layers of metallisation onto a non-conducting substrate, formation of a metallisation pattern, application of a protective barrier layer onto created paths and a layer for soldering and/or welding of parts elements onto conducting paths. Application of solid layers of metallisation is carried out by serial application of an adhesive layer onto a non-conducting path, a current-conducting layer and a metal layer that acts as a mask. To form the metallisation pattern, a mask is created by the method of laser evaporation on sections of the metal layer that acts as a mask, which are not occupied with current-conducting paths, then, using selective chemical etching, the conducting paths and the adhesive sublayer are removed in the opened sections, using selective chemical etching, the mask is removed, afterwards the protective barrier layer is applied, as well as the layer for soldering and/or welding.

EFFECT: invention makes it possible to increase quality of a metallisation pattern, to reduce number of operations and to increase process efficiency.

5 cl, 8 dwg, 6 tbl