FIELD: laser technology, possibly cutting and shaping dielectric and semiconductor materials in different branches of instrument making. SUBSTANCE: directed beam of laser irradiation is focused in point spaced from back surface of treated material for shaping treated portion of blank due to local destruction of it. Beam of laser irradiation is focused inside material for providing near-surface destruction of blank at side of its back surface. Focal point of laser beam is moved inside material towards front wall of blank for shaping necessary surface. EFFECT: possibility of treating materials transparent for laser irradiation at high accuracy degree. 6 cl, 2 dwg
