METHOD OF SEPARATION OF SOLID TRANSPARENT LAMINAS WITH THE LIGHT-EMITTING OR MICROELECTRONIC STRUCTURES Russian patent published in 2005 - IPC

FIELD: optoelectronic industry; methods of materials processing.

SUBSTANCE: the invention is pertaining to the field of optoelectronic industry, to methods of materials processing, in particular, to the methods of scribing and separations of laminas having the light-emitting structures. The invention may be used in the optoelectronic industry at production of light emitting diodes (LEDs). The main purpose of the invention is the problem to develop a method of separation of the solid transparent laminas with the light-emitting or microelectronic structures using a laser emission. The method of separation of laminas is realized by creation of lines formed at the expense of defects caused by the laminas piercing and located in a direction of the technological tracks one over another in the different depths of the sample with a specially chosen range of parameters characterizing the relative poisoning of the defects layers. A laser emission is introduced perpendicularly to a lamina from the lamina side, which does not contain the light-emitting structures. The first layer of defects is formed at a distance from the surface of no more than one depth of a defect. Defects in the subsequent layers in depth are formed at a distance between the centers the defects equal from one up to four diameters of the defects.

EFFECT: the invention presents the method of separation of the solid transparent laminas with the light-emitting or microelectronic structures with the help of a laser emission.

4 cl, 4 dwg