METHOD FOR ELIMINATION OF STRUCTURE FLAWS IN SOLIDS Russian patent published in 1999 - IPC

FIELD: manufacturing of electronic assemblies, integral circuits and equipment. SUBSTANCE: method involves driving acoustic oscillations in solid body, in particular, in film, under room temperature using waves which length is close to effective flaw size and which power is greater than power for flaw activation. EFFECT: decreased side-effects of diffusion and evaporation of doping, prevention of drift of heterojunction structures, evaporation and dissociation of substrate surface layer, generation of thermal non- uniformity and thermal tension, decreased duration of processing and decreased power consumption, possibility to eliminate flaws during operations of vacuum deposition and epitaxial development of film. 3 cl