FIELD: manufacture of semiconductor devices. SUBSTANCE: composition of diluent to wash off unneeded photoresist from plate in process of manufacture of semiconductor devices includes (E), ethyl-3-(EEP) with preferable addition of gamma-butyrolaction. Remainder of photoresist adhered tightly to surface can be completely removed which allows repeat and economic usage of plates. EFFECT: provision for removal of unneeded photoresist from edges and on reverse side of plate by composition demonstrating sufficient insolubility coefficient for photoresist but practically non-toxic for human organism. 16 cl, 2 dwg
