FIELD: microelectronics, in particular, for mounting flat four-in-line chips. SUBSTANCE: method involves prevention of rotation upon mounting, cooling solder, short-time soldering and tearing of semiconductor chip in course of automatic mounting and automatic soldering of chip. In addition method involves making holes for mounting chip in place of its connection to substrate of printed circuit boards, checking against defects, rotation of printed circuit board in rotation assembly, covering its holes with binder in local mounting assembly, ensuring correct positioning of chip in required position and regulation of shape by device for automatic soldering by means of passing ultraviolet light through hole, mounting and fixing chip on printed circuit board side which is clad with copper. EFFECT: improved quality and increased reliability. 10 cl, 8 dwg
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