METALLIC STRUCTURE SOLDERING METHOD Russian patent published in 1999 - IPC

Abstract RU 2133176 C1

FIELD: mechanical engineering; manufacturing of cellular structure members such as exhaust gas catalysts. SUBSTANCE: solder is applied in form of powder and is held on metallic structure by adhesive material. Adhesive material used for holding soldering flux has two different states according to its adhesive capacity in process of manufacture of metallic structure. First state is characterized by low adhesive capability. Second state is characterized by higher adhesive capability. Adhesive capability can be chosen or adjusted depending on external conditions, in particular, depending on temperature. Adhesive material can be applied before, in process of and after coiling or packing of members. EFFECT: enhanced quality of soldering owing to reliable holding of soldering flux, prevention of contamination of welding equipment parts. 17 cl, 6 dwg

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RU 2 133 176 C1

Authors

Vol'Fgang Maus

Ljudvig Vires

Dates

1999-07-20Published

1995-04-26Filed