METHOD OF SOLDER APPLICATION TO STRUCTURE Russian patent published in 2003 - IPC

Abstract RU 2207233 C2

FIELD: applicable in manufacture of structure consisting of tubular case and cellular member. SUBSTANCE: cellular member is formed as a package and/or rolled into coil metal sheets whose, at least, one part presents structurized one with formation of channels for passage of fluid medium. Cellular member is partially installed into tubular case. Section protruding out of case is brought into contact with adhesive composition. Cellular member is finally installed into tubular case, and solder is brought into case. EFFECT: simplified the processing of solder application, before soldering and lowered its cost. 14 cl, 6 dwg

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RU 2 207 233 C2

Authors

Vires Ludvig

Dates

2003-06-27Published

1999-01-21Filed