METHOD FOR CUTTING SEMICONDUCTOR MONOCRYSTALS INTO CHIPS Russian patent published in 1999 - IPC

FIELD: microelectronics. SUBSTANCE: method involves sticking of monocrystal to holder by means of mastic and relative displacement of revolving diamond wheel and holder-mounted monocrystal while delivering cooling liquid to cutting zone; filings of semiconductor materials remaining after cutting them by means of diamond wheel of same grain size as that used for cutting monocrystals are added to mastic as filler, monocrystal is coated with mastic through height of at least two thirds of its diameter. In addition, filings produced in cutting various semiconductor materials, that is mixture of fragments of different semiconductor materials, may be used. EFFECT: improved cutting characteristics due to better conditions of cutting edge in cutting zone. 2 cl