FIELD: electronic engineering; mechanical treatment of materials for electronic-engineering and parts made of them, including semiconductor and ferrite materials.
SUBSTANCE: proposed diamond-containing disk that can be used in particular for machining hybrid and monolithic microwave integrated circuits and their components which needs high quality and high precision of process to keep within their small dimensions and to avoid chipping on them has grain size specified by material being treated and base of its diamond-containing material is hard material. Disk is built of at least two alternating layers of diamond-containing material with damping sublayer in-between connected to them, thickness of this sublayer being equal to 1/10 - 2/3 of diamond-containing material grain size.
EFFECT: enhanced yield and quality of materials and parts machined with aid of disk, enlarged service life of the latter.
1 cl, 1 dwg, 1 tbl
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Authors
Dates
2007-10-10—Published
2006-04-07—Filed