FIELD: mechanical engineering. SUBSTANCE: method relates to cutting of hard-material blocks particularly of semiconductors, glass and ceramics into plates by action of easily fed abrasive and endless circulating strong carrying members. Since the latter passes through peripheral recesses of rollers, it forms chain with parallel axles of roller system. Material being cut is forced through this chain. Strong carrying member, which is saw wire passes through peripheral recesses of roller system rollers consisting of at least one pair of deflecting rollers and at least one pair of guide rollers mounted for rotation in opposite directions. Material being cut is forced into strong carrying member so that it is directed, respectively, to two adjacent cuts of block in opposite directions. In this case, plane- parallelism of walls of cut plates without bevels is obtained with required speed cutting process continuity preserved, that is without power-consuming reversal of direction of strong carrying member movement. EFFECT: enhanced efficiency. 6 cl, 6 dwg
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Authors
Dates
1999-09-27—Published
1997-02-25—Filed