PROCEDURE FOR WIRE CUT OF SILICON INGOT INTO PLATES Russian patent published in 2011 - IPC B28D5/04 

FIELD: machine building.

SUBSTANCE: procedure consists in fixation of ingot on mandrel by means of gluing resin, in feeding ingot in horizontal direction with its side surface through vertical rows of wire up to complete ingot cutting. Vertical rows wetted with abrasive suspension perform cyclic reciprocating motion. With its end section the ingot is fixed on the mandrel. A layer of viscous resin is placed between side surface of the ingot and the mandrel. The mandrel with a glued ingot is arranged vertically with a free end down at angle not less, than 7° to virtual plane wherein there are set rows of wire. The ingot is fed through rows of wire performing cyclic reciprocating motion in horizontal plane.

EFFECT: increased efficiency of cutting process.

1 ex, 3 dwg