FIELD: super-abrasive wire saw winding apparatus, cutting apparatus with super-abrasive wire saw, method for winding super-abrasive wire saw used for cutting by layers silicon grown crystals to silicon chips, for cutting different materials such as metals, polymers, ore, glass, sapphire, rock crystal, SiC and complex semiconductors.
SUBSTANCE: apparatus includes super-abrasive wire saw and winding having peripheral surface and two ends. Said saw has mean diameter D and it includes main wire, binder material embracing surface of main wire and large number of super-abrasive grains fixed on surface of main wire by means of binder material. Super-abrasive wire saw is uncoiled successively towards blank and it is coiled due to reciprocation motion around outer surface of winding between its two ends for forming large number of layers. Pitch P of coiling super-abrasive wire saw around peripheral surface of winding satisfies to relation D<P<2D.
EFFECT: reduced number of damages of binder material, lowered quantity of fallen out super-abrasive grains.
17 cl, 8 dwg
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