FIELD: selective removal of materials by irradiation. SUBSTANCE: method of removal of undesirable material from treated surface of substrate includes: supply to around undesirable material of flow of gas practically inert relative to undesirable material; irradiation of said undesirable material. Undesirable material subject to removal is practically continuous film of undesirable material covering the desired material. Irradiation of said undesirable material includes treatment of preliminarily preset surface of said practically continuous film energetic photons with spatial and time concentrations within limits of preliminarily preset surface and sufficient for freeing of film of undesirable material corresponding to interface surface from treated and insufficient for increase of temperature of desirable material in excess of temperature at which desirable material melts or physical properties of desirable material are changed by some other way. Irradiation of undesirable material is repeated until said practically continuous film of undesirable material is removed without changing physical properties of desired material. Offered group of inventions includes: method of selective removal of undesirable material from treated surface of substrate; method of production of structures on treated surface of substrate; method of levelling of substrate treated surface; method of reduction of roughness of treated surface. EFFECT: higher efficiency of removal of undesirable material from substrate, possible removal of very fine particles without impairing physical properties of substrate, excluded use of expensive materials and absent toxic materials formed in process. 20 cl, 9 dwg, 22 tbl
