METHOD OF FORMING RELIEF FROM ELECTRONIC OR PHOTONIC MATERIAL Russian patent published in 2013 - IPC H01L51/00 H01L21/308 

FIELD: physics.

SUBSTANCE: method of forming a relief from electronic or photonic material on a substrate involves treating the surface of the substrate by depositing a surface energy modifying layer and structuring said surface energy modifying layer to provide said surface with a pattern which determines where said electronic or photonic material should be present, forming a film from said electronic or photonic material on said substrate, wherein the film fills said pattern, overlaps edges of said pattern and has regions stretching beyond said edges of said pattern, and laying an adhesive on the underlying material and tearing off said adhesive for selective removal of regions of said electronic or photonic material from said film, leaving on said substrate said structured electronic or photonic material and said surface energy modifying layer.

EFFECT: novel simple technique of forming a relief, which enables to structure semiconductor polymers with high resolution.

29 cl, 6 dwg