HEAT-TRANSFER APPARATUS FOR HIGH-POWER SEMICONDUCTOR LASERS Russian patent published in 2001 - IPC

FIELD: cooling systems for high-power lasers. SUBSTANCE: apparatus is designed for rigid fixation to cool down active layer of laser strips, laser diode arrays, etc. It has twin array of straight slit-type micro channels and heat-transfer plate made of high-heat-conductivity material that covers mentioned array. Newly introduced in apparatus is heat-transfer array of straight slit-type micro channels joined to heat-transfer plate and positioned perpendicular to twin array of straight strip-like micro channels whose micro channels are open at bottom and communicate with those of twin hydraulic array ensuring coolant supply to and discharge from upper heat- transfer array. EFFECT: augmented wall-to-liquid heat transfer, improved uniformity of heat transfer through device section due to turbulent coolant flow. 5 dwg