FIELD: electrical engineering, in particular, members and units of electronic circuits, which output significant amount of heat, which should be removed to environment by means of either convection and/or transfer. SUBSTANCE: device, which removes heat from housing of electronic unit, which produces heat, comprises a complex-shape member, which is made from heat-conducting synthetic material, is located on housing of electronic unit or is connected to it by means of heat diffuser, so that the complex-shape member is in planar contact to said housing or heat diffuser, at least, over some of its pieces. Goal of invention is achieved by production of complex-shape member directly on surface of housing of electronic unit or heat diffuser. Respective method for its production involves application of heat-conducting synthetic material in plastic state under pressure in order to produce complex-shape member directly on surface of housing of electronic unit or heat diffuser. Said material is hardened or sewed and gripped to surface of said housing in point, where complex-shape member is produced. EFFECT: increased functional capabilities, facilitated manufacturing and use. 15 cl, 18 dwg
