METHOD FOR FILLING OF CONFIGURED CAVITIES WITH THICK VISCOUS MEDIUM Russian patent published in 2000 - IPC

FIELD: procedure of filling of configured cavities with thick viscous medium, in particular with epoxy compound, applicable for filling of holes in vital parts when filling is a construction member and must withstand high loads, because of it no gas, oil and other inclusions resulting in reduction of filling strength are allowed in it and on its walls. SUBSTANCE: the cavity in the part is preliminarily filled with solvent not interacting with thick viscous medium. Then, the part is joined to the charging device filled with thick viscous medium, and this assembly is subjected to centrifugation. The charging device has a hole through which the thick viscous medium can flow to the part cavity under the action of centrifugal force displacing the solvent from it to the charging device. Centrifugation is continued up to the beginning of medium curing. EFFECT: facilitated procedure. 3 cl, 1 dwg