FIELD: semiconductor chips for integrated-circuit cards. SUBSTANCE: device has coating mass surrounding and protecting semiconductor chip and at least two leads made of conducting material, their ends facing one another being of reduced thickness. EFFECT: enhanced failure protection reliability. 12 cl, 8 dwg _
| Title | Year | Author | Number |
|---|---|---|---|
| CARD HAVING BUILT-IN IC-CHIP AND SEMICONDUCTOR IC-CHIP USABLE WITH THE CARD | 1997 |
|
RU2190879C2 |
| INTEGRATED CIRCUIT MODULE | 1996 |
|
RU2173476C2 |
| PROCESS OF MANUFACTURE OF MODULE OF CARD WITH MICROCIRCUIT, MODULE OF CARD WITH MICROCIRCUIT MANUFACTURED BY PROCESS AND MULTIPURPOSE CARD WITH MICROCIRCUIT CARRYING THIS MODULE | 1997 |
|
RU2161331C2 |
| CARRYING MEMBER FOR SEMICONDUCTOR INTEGRATED CIRCUIT | 1997 |
|
RU2156521C2 |
| INTEGRATED-CIRCUIT CARD MODULE | 1997 |
|
RU2189635C2 |
| CARD WITH BUILT-IN INTEGRATED CIRCUIT AND ITS MANUFACTURING PROCESS | 1997 |
|
RU2170457C2 |
| NONCONDUCTING SUBSTRATE FORMING BAND OR UNIT OF USE MOUNTING PLURALITY OF BEARING MEMBERS | 1997 |
|
RU2202126C2 |
| INTEGRAL CIRCUIT ASSEMBLY | 1996 |
|
RU2145732C1 |
| CARRYING FRAME | 1995 |
|
RU2124756C1 |
| INTEGRATED-CIRCUIT MODULE AND ITS MANUFACTURING PROCESS | 1997 |
|
RU2165660C2 |
