CHAMFERING DEVICE FOR FINISHING SEMICONDUCTOR PLATES Russian patent published in 2001 - IPC

FIELD: manufacturing semiconductor devices; mechanical engineering. SUBSTANCE: device has housing incorporating central cylindrical and peripheral annular air chambers separated by means of cylindrical partition and arranged for communicating with compressed air supply main via adjustable pneumatic valves connected to control unit; it also has plate rotating drive in the form of truncated cone whose side surface is fixed in position and is, essentially, rough surface; provided in smaller base of truncated cone at bottom of conical seat are central bore and tilted nozzles set along tangential line to circumference of concentric conical grinding surface and connected, respectively, to central and peripheral air chambers placed under bottom of conical seat that mounts speed transducer. Device is noted for dispensing with mechanically moving parts, provides for chamfering plates throughout their entire perimeter and for cooling the plates in the course of their chamfering; it is easy to check and to adjust pressure applied to plate for clamping it to surface being ground. EFFECT: enhanced yield, reduced cost and time required for finishing operations. 4 dwg