FIELD: semiconductor instruments, mechanical engineering. SUBSTANCE: device has stage with inclined nozzles which generate air layer, clippers, position detectors. Clippers are designed as clipping socket. Inclined nozzles are arranged in circle and are directed to opposite directions in alternating order. EFFECT: increased functional capabilities. 4 dwg
Title | Year | Author | Number |
---|---|---|---|
PLATE POSITIONING DEVICE | 1997 |
|
RU2131155C1 |
DEVICE FOR ORIENTATION OF PLATES | 1996 |
|
RU2099816C1 |
DEVICE FOR PLATE ORIENTATION | 1996 |
|
RU2099815C1 |
CHAMFERING DEVICE FOR FINISHING SEMICONDUCTOR PLATES | 2000 |
|
RU2163408C1 |
GEAR TO TAKE OFF CHAMFER IN PROCESS OF FINISHING TREATMENT OF SEMICONDUCTOR PLATE | 2000 |
|
RU2168796C1 |
SEMICONDUCTOR PLATE GRINDER | 2001 |
|
RU2191674C1 |
SEMICONDUCTOR WAFER COOLING DEVICE | 2001 |
|
RU2193258C2 |
METHOD AND DEVICE FOR COOLING DOWN SEMICONDUCTOR WAFERS | 1999 |
|
RU2153209C1 |
METHOD AND DEVICE FOR PRODUCING PHOTORESIST COATING | 1999 |
|
RU2158987C1 |
APPARATUS FOR GRINDING SEMICONDUCTOR PLATES | 2000 |
|
RU2175283C1 |
Authors
Dates
1997-12-10—Published
1996-07-22—Filed